Schedule |
The schedule for the full Layer 0 Silicon project is summarized in the Microsoft Project file.
Below is a task list sorted by finish date. Tasks scheduled to end in the current month or before
are coded by current status.
| Task Complete | |||||
| In progress on schedule | |||||
| Delayed, no schedule impact | |||||
| Delayed, schedule impact | |||||
| WBS | Task Status 1-13-2004 | Duration | Start | Finish | Status |
| 1.6.1.1 | Probe Stations Ready | 0 w | 11/03/03 | 11/03/03 | |
| 1.6.2.2 | SASEQ Test Stands Available | 0 w | 11/03/03 | 11/03/03 | |
| 1.6.4.2 | Module Burn-in Stands Available | 0 w | 11/03/03 | 11/03/03 | |
| 1.6.3.1.1 | Design mechanical structures | 6 w | 11/03/03 | 12/16/03 | |
| 1.6.3.1.2 | Conduct finite element analysis (mechanical) | 6 w | 11/03/03 | 12/16/03 | |
| 1.6.3.1.3 | Freeze Mechanical Parameters | 0 w | 12/16/03 | 12/16/03 | |
| 1.6.2.1 | SVX4 Chips Available | 0 w | 01/05/04 | 01/05/04 | |
| 1.6.3.1.4 | Design cooling components/assembly | 3 w | 12/17/03 | 01/15/04 | |
| 1.6.3.1.5 | Conduct finite element analysis (thermal) | 3 w | 12/17/03 | 01/15/04 | |
| 1.6.1.2 | Design short sensors | 4 w | 12/17/03 | 01/23/04 | |
| 1.6.1.3 | Design long sensors | 4 w | 12/17/03 | 01/23/04 | |
| 1.6.2.7.1 | Design twisted-pair cables | 2 w | 01/09/04 | 01/23/04 | |
| 1.6.2.3.1 | Design hybrids | 5 w | 12/17/03 | 01/30/04 | |
| 1.6.3.1.6 | Integrate designs (sensors, grounding, cooling) | 2 w | 01/16/04 | 01/30/04 | |
| 1.6.1.5 | Conduct sensor production readiness review | 1 w | 01/26/04 | 01/30/04 | |
| 1.6.2.7.2 | Conduct twisted-pair cable production readiness review | 1 w | 01/26/04 | 01/30/04 | |
| 1.6.2.4.1 | Design analog cables and spacers | 12 w | 11/03/03 | 02/06/04 | |
| 1.6.2.6.1 | Design digital cables | 4 w | 01/09/04 | 02/06/04 | |
| 1.6.1.4 | Vendor RFQ | 2 w | 01/26/04 | 02/06/04 | |
| 1.6.2.3.2 | Conduct hybrid production readiness review | 1 w | 02/02/04 | 02/06/04 | |
| 1.6.3.1 | Support Structures Design | 65 d | 11/03/03 | 02/13/04 | |
| 1.6.3.1.7 | Prepare drawings | 2 w | 02/02/04 | 02/13/04 | |
| 1.6.3.7.1 | Prepare final production and assembly drawings | 2 w | 02/02/04 | 02/13/04 | |
| 1.6.2.4.2 | Conduct analog cable production readiness review | 1 w | 02/09/04 | 02/13/04 | |
| 1.6.2.6.2 | Conduct digital cable production readiness review | 1 w | 02/09/04 | 02/13/04 | |
| 1.6.3.3 | Production Readiness Review | 5 d | 02/16/04 | 02/20/04 | |
| 1.6.3.3.1 | Conduct production readiness review (UW) | 1 w | 02/16/04 | 02/20/04 | |
| 1.6.3.3.2 | Conduct production readiness review (Fermilab) | 1 w | 02/16/04 | 02/20/04 | |
| 1.6.3.3.3 | Support Structures Ready For Production | 0 w | 02/20/04 | 02/20/04 | |
| 1.6.2.5.1 | Design grounding circuits | 4 w | 02/02/04 | 02/27/04 | |
| 1.6.2.7.3 | Bid twisted-pair cable production | 4 w | 02/02/04 | 02/27/04 | |
| 1.6.2.3.3 | Bid hybrid production | 3 w | 02/09/04 | 02/27/04 | |
| 1.6.2.4.3 | Bid analog cable production | 2 w | 02/16/04 | 02/27/04 | |
| 1.6.2.9.1 | Design adapter cards | 16 w | 11/03/03 | 03/05/04 | |
| 1.6.2.6.3 | Bid digital cable production | 4 w | 02/16/04 | 03/12/04 | |
| 1.6.5.1.1 | Design support structure holding fixtures | 4 w | 02/16/04 | 03/12/04 | |
| 1.6.3.4.1 | Design final production tooling | 3 w | 02/23/04 | 03/12/04 | |
| 1.6.3.5.1 | Design final QA tooling | 3 w | 02/23/04 | 03/12/04 | |
| 1.6.2.5.2 | Bid grounding circuits | 2 w | 03/01/04 | 03/12/04 | |
| 1.6.4.3.4 | Finalize L0 wirebonding fixtures | 2 w | 03/01/04 | 03/12/04 | |
| 1.6.2.8.1 | Design junction cards | 12 w | 12/17/03 | 03/19/04 | |
| 1.6.1.6 | Prepare sensor req and PO | 6 w | 02/09/04 | 03/19/04 | |
| 1.6.4.3.1 | Finalize readout module fabrication fixtures | 4 w | 02/23/04 | 03/19/04 | |
| 1.6.1.7 | Release Sensors for Production | 0 w | 03/19/04 | 03/19/04 | |
| 1.6.2.3.4 | Prepare hybrid req and PO | 4 w | 03/01/04 | 03/26/04 | |
| 1.6.2.4.4 | Prepare analog cable req and PO | 4 w | 03/01/04 | 03/26/04 | |
| 1.6.2.7.4 | Prepare twisted-pair cable req and PO | 4 w | 03/01/04 | 03/26/04 | |
| 1.6.3.4.2 | Prepare final production tooling drawings | 2 w | 03/15/04 | 03/26/04 | |
| 1.6.3.5.2 | Prepare final QA tooling drawings | 2 w | 03/15/04 | 03/26/04 | |
| 1.6.2.8.2 | Conduct junction card production readiness review | 1 w | 03/22/04 | 03/26/04 | |
| 1.6.2.3.5 | Release Hybrids for Production | 0 w | 03/26/04 | 03/26/04 | |
| 1.6.2.4.5 | Release Analog Cables for Production | 0 w | 03/26/04 | 03/26/04 | |
| 1.6.2.7.5 | Release Twisted-pair Cables for Production | 0 w | 03/26/04 | 03/26/04 | |
| 1.6.5.2.1 | Design module installation fixtures | 8 w | 02/16/04 | 04/09/04 | |
| 1.6.3.4 | Final Fabrication Tooling | 35 d | 02/23/04 | 04/09/04 | |
| 1.6.3.5 | Final Quality Assurance Tooling | 35 d | 02/23/04 | 04/09/04 | |
| 1.6.2.5.3 | Procure grounding circuits | 4 w | 03/15/04 | 04/09/04 | |
| 1.6.2.6.4 | Prepare digital cable req and PO | 4 w | 03/15/04 | 04/09/04 | |
| 1.6.3.4.3 | Fabricate final production tooling | 2 w | 03/29/04 | 04/09/04 | |
| 1.6.3.5.3 | Fabricate final QA tooling | 2 w | 03/29/04 | 04/09/04 | |
| 1.6.2.6.5 | Release Digital Cables for Production | 0 w | 04/09/04 | 04/09/04 | |
| 1.6.2.5 | Flex Grounding Circuits | 55 d | 02/02/04 | 04/16/04 | |
| 1.6.2.5.4 | Test grounding circuits | 1 w | 04/12/04 | 04/16/04 | |
| 1.6.2.8.3 | Prepare junction card req and PO | 4 w | 03/29/04 | 04/23/04 | |
| 1.6.2.8.4 | Release Junction Cards for Production | 0 w | 04/23/04 | 04/23/04 | |
| 1.6.2.12.1 | Test mixed SVX2/SVX4 readout | 24 w | 11/03/03 | 04/30/04 | |
| 1.6.2.3.7 | Procure parts (FNAL) | 12 w | 02/09/04 | 04/30/04 | |
| 1.6.2.3.8 | Procure parts (Fresno) | 12 w | 02/09/04 | 04/30/04 | |
| 1.6.2.9.2 | Procure prototypes | 8 w | 03/08/04 | 04/30/04 | |
| 1.6.5.1.2 | Procure support structure holding fixtures | 8 w | 03/15/04 | 05/07/04 | |
| 1.6.5.1 | Layer 0 Support Structure Holding Fixtures | 65 d | 02/16/04 | 05/14/04 | |
| 1.6.5.1.3 | QC support structure holding fixtures | 1 w | 05/10/04 | 05/14/04 | |
| 1.6.3.6 | Produce preproduction samples for testing | 6 w | 04/12/04 | 05/21/04 | |
| 1.6.2.9.3 | Test prototypes | 4 w | 05/03/04 | 05/28/04 | |
| 1.6.4.1 | Fabricate module boxes | 12 w | 03/15/04 | 06/07/04 | |
| 1.6.4.3.5 | Procure production L0 wirebonding fixtures | 12 w | 03/15/04 | 06/07/04 | |
| 1.6.4.3.6 | QC production L0 wirebonding fixtures | 1 w | 06/08/04 | 06/14/04 | |
| 1.6.2.7.6 | Procure parts for twisted-pair cables | 12 w | 03/29/04 | 06/21/04 | |
| 1.6.2.8.5 | Produce junction cards | 8 w | 04/26/04 | 06/21/04 | |
| 1.6.3.2 | Development and integration of design (FNAL) | 26 w | 12/17/03 | 06/28/04 | |
| 1.6.2.3.6 | Produce hybrids | 14 w | 03/29/04 | 07/06/04 | |
| 1.6.2.6.6 | Produce digital cables | 12 w | 04/12/04 | 07/06/04 | |
| 1.6.5.2.2 | Procure module installation fixtures | 12 w | 04/12/04 | 07/06/04 | |
| 1.6.3.7.2 | Procure/manufacture final production parts | 6 w | 05/24/04 | 07/06/04 | |
| 1.6.2.3.9 | Hybrid Boxes Available | 0 w | 07/06/04 | 07/06/04 | |
| 1.6.5.2 | Layer 0 Module Installation Fixtures | 105 d | 02/16/04 | 07/13/04 | |
| 1.6.4.3.2 | Procure production layer 0 readout module fixtures | 16 w | 03/22/04 | 07/13/04 | |
| 1.6.5.2.3 | QC module installation fixtures | 1 w | 07/07/04 | 07/13/04 | |
| 1.6.2.8 | Junction Cards | 145 d | 12/17/03 | 07/20/04 | |
| 1.6.2.4.6 | Produce analog cables | 16 w | 03/29/04 | 07/20/04 | |
| 1.6.2.8.6 | Test junction cards | 4 w | 06/22/04 | 07/20/04 | |
| 1.6.2.3.10.4 | Wipe hybrids | 2 w | 07/07/04 | 07/20/04 | |
| 1.6.2.8.7 | All Junction Cards Produced and Tested | 0 w | 07/20/04 | 07/20/04 | |
| 1.6.5.17 | Monitoring | 150 d | 12/17/03 | 07/27/04 | |
| 1.6.5.17.1 | Temperature Monitoring | 30 w | 12/17/03 | 07/27/04 | |
| 1.6.4.3 | Production Module Fixtures | 110 d | 02/23/04 | 07/27/04 | |
| 1.6.2.6.7 | Terminate digital cables | 3 w | 07/07/04 | 07/27/04 | |
| 1.6.4.3.3 | QC production readout module fixtures | 2 w | 07/14/04 | 07/27/04 | |
| 1.6.5.3 | Design and fabricate detector garage | 2 w | 07/14/04 | 07/27/04 | |
| 1.6.2.3.10.1 | Develop functionality test (Fresno) | 4 w | 07/07/04 | 08/03/04 | |
| 1.6.3.7.3 | Assemble final support structures | 4 w | 07/07/04 | 08/03/04 | |
| 1.6.2.10.1 | Design HV System | 10 w | 06/01/04 | 08/10/04 | |
| 1.6.2.3.10.5 | Measure hybrids (mechanical) | 3 w | 07/21/04 | 08/10/04 | |
| 1.6.2.10.2 | Release HV System for Production | 0 w | 08/10/04 | 08/10/04 | |
| 1.6.2.12.2 | Test adapter card schemes | 12 w | 05/24/04 | 08/17/04 | |
| 1.6.3.7.4 | Perform quality assurance checks on final support structures | 2 w | 08/04/04 | 08/17/04 | |
| 1.6.3.7.5 | All Support Structures Completed | 0 w | 08/17/04 | 08/17/04 | |
| 1.6.2.6 | Digital Cables | 160 d | 01/09/04 | 08/24/04 | |
| 1.6.3.7 | Final Support Structures Production | 145 d | 02/02/04 | 08/24/04 | |
| 1.6.2.6.8 | Test digital cables | 4 w | 07/28/04 | 08/24/04 | |
| 1.6.3.7.6 | Ship to Fermilab | 1 w | 08/18/04 | 08/24/04 | |
| 1.6.2.6.9 | All Digital Cables Delivered and Tested | 0 w | 08/24/04 | 08/24/04 | |
| 1.6.3.7.7 | All Support Structures Received At Fermilab | 0 w | 08/24/04 | 08/24/04 | |
| 1.6.2.3.10.6 | Probe bare hybrids | 6 w | 07/21/04 | 08/31/04 | |
| 1.6.2.3.10.2 | Develop hybrid burn-in test (KU) | 4 w | 08/04/04 | 08/31/04 | |
| 1.6.2.3.10.3 | Develop hybrid burn-in test (FNAL) | 4 w | 08/04/04 | 08/31/04 | |
| 1.6.2.12.3 | Move test setup to Lab C | 2 w | 08/18/04 | 08/31/04 | |
| 1.6.2.7.7 | Assemble twisted-pair cables | 12 w | 06/22/04 | 09/15/04 | |
| 1.6.2.9.4 | Develop final specifications (KSU) | 4 w | 08/18/04 | 09/15/04 | |
| 1.6.2.9.5 | Develop final specifications (Fermilab) | 4 w | 08/18/04 | 09/15/04 | |
| 1.6.3 | Mechanical Design and Fabrication | 220 d | 11/03/03 | 09/22/04 | |
| 1.6.1.8 | Produce sensors | 26 w | 03/22/04 | 09/22/04 | |
| 1.6.4.4.1 | Qualify fixtures and procedures | 8 w | 07/28/04 | 09/22/04 | |
| 1.6.3.8 | Perform final article QA checks of support structure components/assemblies | 4 w | 08/25/04 | 09/22/04 | |
| 1.6.2.9.6 | Conduct adapter card production readiness review | 1 w | 09/16/04 | 09/22/04 | |
| 1.6.2.4 | Analog Cables | 225 d | 11/03/03 | 09/29/04 | |
| 1.6.2.4.7 | Test analog cables | 10 w | 07/21/04 | 09/29/04 | |
| 1.6.2.4.8 | All Analog Cables Delivered and Tested | 0 w | 09/29/04 | 09/29/04 | |
| 1.6.2.7 | Twisted-Pair Cables | 195 d | 01/09/04 | 10/13/04 | |
| 1.6.2.7.8 | Test twisted-pair cables | 4 w | 09/16/04 | 10/13/04 | |
| 1.6.2.9.7 | Bid adapter card production | 3 w | 09/23/04 | 10/13/04 | |
| 1.6.2.7.9 | All Twisted-pair Cables Assembled and Tested | 0 w | 10/13/04 | 10/13/04 | |
| 1.6.2.10.3 | Produce HV System | 10 w | 08/11/04 | 10/20/04 | |
| 1.6.2.3.10.7 | Stuff and wirebond hybrids | 8 w | 09/01/04 | 10/27/04 | |
| 1.6.2.9.8 | Prepare adapter card req and PO | 4 w | 10/14/04 | 11/10/04 | |
| 1.6.2.9.9 | Release Adapter Cards for Production | 0 w | 11/10/04 | 11/10/04 | |
| 1.6.2.10 | High-Voltage System | 120 d | 06/01/04 | 11/17/04 | |
| 1.6.1.9 | Probe sensors (FNAL) | 8 w | 09/23/04 | 11/17/04 | |
| 1.6.1.10 | Probe sensors (MRI) | 8 w | 09/23/04 | 11/17/04 | |
| 1.6.1.12 | Irradiate test structures | 4 w | 10/21/04 | 11/17/04 | |
| 1.6.2.10.4 | Test HV System | 4 w | 10/21/04 | 11/17/04 | |
| 1.6.1.13 | All Sensors Delivered and Tested | 0 w | 11/17/04 | 11/17/04 | |
| 1.6.2.3.10.8 | Perform initial functionality test | 4 w | 10/28/04 | 11/24/04 | |
| 1.6.4.4.2 | Produce preproduction modules | 2 w | 11/29/04 | 12/10/04 | |
| 1.6.4.4 | Preproduction Modules | 105 d | 07/28/04 | 01/04/05 | |
| 1.6.4.4.3 | Test preproduction modules | 2 w | 12/13/04 | 01/04/05 | |
| 1.6.4.5 | Conduct L0 module production readiness review | 1 w | 01/05/05 | 01/11/05 | |
| 1.6.5.4 | Certify module mounting procedures | 1 w | 01/05/05 | 01/11/05 | |
| 1.6.4.6.1 | Silicon L0 Module Production Begun | 0 w | 01/18/05 | 01/18/05 | |
| 1.6.2.3 | Hybrids | 265 d | 12/17/03 | 01/19/05 | |
| 1.6.2.3.10 | Test Hybrids | 130 d | 07/07/04 | 01/19/05 | |
| 1.6.2.3.10.9 | Perform hybrid burn-in tests | 8 w | 11/11/04 | 01/19/05 | |
| 1.6.2.3.11 | All L0 Hybrids Delivered, Stuffed, and Tested | 0 w | 01/19/05 | 01/19/05 | |
| 1.6.2.9.10 | Produce adapter cards | 9 w | 11/11/04 | 01/26/05 | |
| 1.6.2.9 | Adapter Cards | 320 d | 11/03/03 | 02/23/05 | |
| 1.6.2.9.11 | Test adapter cards | 4 w | 01/27/05 | 02/23/05 | |
| 1.6.2.9.12 | All Adapter Cards Delivered and Tested | 0 w | 02/23/05 | 02/23/05 | |
| 1.6.4.6.2 | Prepare sensors for module production | 8 w | 01/12/05 | 03/09/05 | |
| 1.6.4.6.3 | Align and glue pair of flex cables | 8 w | 01/18/05 | 03/14/05 | |
| 1.6.4.6.4 | Align and glue sensor to flex cable | 8 w | 01/20/05 | 03/16/05 | |
| 1.6.4.6.5 | Perform sensor-to-flex cable wirebonds | 8 w | 01/24/05 | 03/18/05 | |
| 1.6.4.6.6 | Attach end hybrids to flex cable | 8 w | 01/26/05 | 03/22/05 | |
| 1.6.4.6.7 | Wirebond end hybrid to flex cable | 8 w | 01/28/05 | 03/24/05 | |
| 1.6.4.6.8 | Silicon L0 Module Production Complete | 0 w | 03/24/05 | 03/24/05 | |
| 1.6.4.6.9 | Debug sensor modules | 8 w | 02/01/05 | 03/28/05 | |
| 1.6.4.6.10 | Burn-in sensor modules | 8 w | 02/08/05 | 04/04/05 | |
| 1.6.2.12.4 | Test with final adapter cards | 8 w | 02/17/05 | 04/13/05 | |
| 1.6.4.6.11 | Evaluate and repair sensor modules | 8 w | 02/22/05 | 04/18/05 | |
| 1.6.5.5 | Mount layer 0 sensor modules | 8 w | 03/15/05 | 05/09/05 | |
| 1.6.5.18 | Software and Simulation | 75 w | 11/03/03 | 05/11/05 | |
| 1.6.4 | Layer 0 Detector Modules | 378 d | 11/03/03 | 05/16/05 | |
| 1.6.4.6 | Module Production | 88 d | 01/12/05 | 05/16/05 | |
| 1.6.4.6.12 | Perform quality assurance tests | 14 w | 02/08/05 | 05/16/05 | |
| 1.6.5.6 | Verify sensor alignment | 1 w | 05/10/05 | 05/16/05 | |
| 1.6.4.6.13 | Silicon L0 Module Production and Testing Complete | 0 w | 05/16/05 | 05/16/05 | |
| 1.6.5.7 | Install temperature sensors | 1 w | 05/17/05 | 05/23/05 | |
| 1.6.2.11 | Readout Chain Integration | 78 w | 11/03/03 | 06/02/05 | |
| 1.6.5.10 | Beams Div bakeout and leak check of beam pipe | 2 w | 05/19/05 | 06/02/05 | |
| 1.6.5.8 | Perform initial electrical test of readout | 2 w | 05/24/05 | 06/07/05 | |
| 1.6.5.11 | SiDet leak check of beam pipe | 0.6 w | 06/03/05 | 06/07/05 | |
| 1.6.2 | Readout Electronics | 395 d | 11/03/03 | 06/09/05 | |
| 1.6.2.12 | Full Chain Tests | 395 d | 11/03/03 | 06/09/05 | |
| 1.6.2.12.5 | Test full, final system | 8 w | 04/14/05 | 06/09/05 | |
| 1.6.2.12.6 | Full Chain System Test Completed | 0 w | 06/09/05 | 06/09/05 | |
| 1.6.5.9 | Install outer shell | 1 w | 06/08/05 | 06/14/05 | |
| 1.6.5.12 | Install beam pipe | 0.2 w | 06/15/05 | 06/15/05 | |
| 1.6.1 | Sensors | 415 d | 11/03/03 | 07/08/05 | |
| 1.6.1.11 | Long-term sensor tests | 39 w | 09/23/04 | 07/08/05 | |
| 1.6.5.13 | Test final system | 4 w | 06/16/05 | 07/14/05 | |
| 1.6.5.14 | Layer 0 Silicon Detector Assembly and Testing Complete | 0 w | 07/14/05 | 07/14/05 | |
| 1.6 | Layer 0 Silicon Detector | 424 d | 11/03/03 | 07/21/05 | |
| 1.6.5 | Final Detector Integration and Assembly | 424 d | 11/03/03 | 07/21/05 | |
| 1.6.5.15 | Prepare for transport to DAB | 1 w | 07/15/05 | 07/21/05 | |
| 1.6.5.16 | Layer 0 Silicon Detector Ready to Move to DAB | 0 w | 07/21/05 | 07/21/05 |