Minutes Run IIB Silicon Sensor Meeting,
These minutes can be found at:
Report on CDF PRR (Frank Lehner)
o Frank was on the review committee for the CDF silicon sensor Production Readiness Review (PRR). CDF submitted three documents to the committee: general QA document, characterization of non-irradiated sensors, and characterization of irradiated sensors. The irradiation of the CDF sensors was done in one step to an equivalent 1 MeV neutron dose of ~10**14. He was impressed with the effort by the collaboration to fully understand the various anomalies they observed in their testing. He also noted that the PRR seemed to be for all silicon sensors and no distinction was made for the inner layer sensors.
of the documentation that was submitted by the CDF collaboration can be
obtained from Hara’s web site
presentation made by Hara to the committee is:
Stony Brook Test Site Status (Bob McCarthy)
o Bob described the status of the Stony Brook site. They made good strides in probing the detectors. The main problem that still nags them is that the program crashes after probing about 50 strips. It was deemed necessary that this got resolved before the site could be fully certified. Stony Brook was also encouraged to obtain the ability to perform the full suite of tests as described in our QA document, though with higher priority that getting the bug in the program resolved.
Probe Results of Outer Layer Teststructures at KSU (Sergey Korjenevski)
o KSU started the visual inspection of the outer layer sensors. One open implant in an intermediate strip was observed.
o The interstrip capacitance was measured on test structures and are consistent with the spec of 1.2 pF/cm.
o The breakdown of the coupling capacitance was measured to be 200V, in agreement with the Fermilab measurements.
o The resistance of various features in various configurations were measured and some questions were raised; the Al strip resistance, for example, seemed too high. See the talk for more details.
Discussion on how to prepare for the PRR
o Suggestions were made on how to prepare for the PRR. An incomplete list of things that we need to do is
1. Clear exposition of content of QA assurance document and which sensors have been subjected to which tests
2. Comparison of defects flagged by HPK and our follow up
3. Need for visual inspection, at the very least of the defects observed
4. Systematic measurement of interstrip capacitance
5. Measurement of Ccc as function of frequency
6. How to setup for production testing, including possible laser test for (non)-irradiated sensors
o A full proposal will be distributed before the collaboration meeting.
Link to the Run IIb silicon page
Links to minutes archive