FY99Q3
Apr-Jun 1999

Significant areas of progress during the quarter included:

• The completion of a DoE (Lehman) review of the project in mid-June.
• The completion of a "full-crate" readout test for the silicon detector system.
• The start of assembly of the muon forward trigger system octants.
• A successful "Online Workshop".

Areas of concern centered on:

• vendor production rate and delivery of good silicon detectors.
• vendor production and delivery of flexible circuits for both the silicon and fiber trackers.
• MDT production difficulties related to delays in the delivery of some muon system parts in Russia.

Progress continued on the manufacture of parts for extension of the cryogenic transfer lines and valve boxes in the DØ collision hall and for the DØ He purified.

Realignment and calibration of the Hall probes continued in preparation for precise field mapping of the solenoid scheduled for the last quarter of FY99.

Progress was made in the manufacture and procurement of the beryllium beam pipe and parts for the massive forward shielding. The later will be used to pre-assemble the shielding prior to its installation.

Full production began on three of the five assembly types (2-degree, H-disk, and single-sided). Production of 2-degree ladders began in May and H-disk and single-sided production began in June. The availability of assembled and tested electronics (HDIs) and the number of qualified fixtures limit production rates. Problems with the quality of wirebonds on some HDI types also have occurred. Test stands are in place for components and assembled ladders. Current production rates are:

• Single-sided - 5 per week
• Two-degree - 2 per week
• H-disk - 1-2 per week

Production and testing procedures will continue to be refined during the next quarter with the goal of increasing the production throughput.

All beryllium parts have been received and the "dry assembly" of barrels began using a coordinate measuring machine (CMM) with a camera set at a 45-degree angle. Cooling system design neared completion and test system installation began in Lab C. Designs of the final fixture types (F-disk and 90-degree) were completed and parts were ordered. Design of the final installation fixtures will be a focus of work during the next two quarters.

Cylinder 3A ribbon mounting was completed, and ribbon fabrication continued on the axial and stereo ribbons for cylinder 3B. Fabrication of additional tooling for ribbon mounting also began. All connectors for cylinder 8 were received and quality control checks are underway, and fabrication of connectors for cylinder 7 is beginning at the vendor. Additional tests on light-coupling efficiency for the curved torlon connector system indicated a coupling efficiency of more than 90%. All mandrels for the support cylinders have been delivered, and support cylinders 7 and 8 have been fabricated. VLPC testing was completed and all devices were delivered to Fermilab. Work continued on identifying and qualifying a vendor for VLPC flex circuits. One vendor, Compunetics has delivered circuits that are very close to meeting the full specification.

All large detector modules (35, including spares) have been fabricated. Four small modules have been constructed and cut, and nineteen more have been fabricated and await a modification of the cutting procedure. Connector assemblies for the wavelength-shifting fiber for all the large modules have been fabricated and shipped to BNL, where they undergo quality control tests and are installed in the modules. Sixteen large modules have been cabled, tested, and dressed with all attendant protective covers. Five final calibration systems have been delivered, installed, and tested. The mold for the 45-degree wedges of lead absorber is undergoing a final iteration before production parts can be poured and machined. Machining of all parts of the support structure is complete, except for the outer ring for support of the lead. This ring awaits approval of the mold for the lead production pieces. Assembly procedures for the remainder of the aluminum support frames have been developed, and assembly is proceeding. Shipping containers also are being fabricated.

Acceptance tests were completed for the VRB, VTM, J3 backplane, and sequencer modules used in the silicon 10% test. The VRB, VTM and backplanes were released for production and the first modules should arrive in July. The sequencer required two component changes so two additional prototypes are being built before that module is released for production. These prototypes are due at the end of July. The VRB controller card required some redesign that should be finished by early August.

The balance of 55,000 premplifiers has been released for production and only minor contract issues remain to be resolved. The study of 2,500 channels in the 5000-channel test setup continued, with an emphasis on coherent noise studies. The final design revisions to the preamp motherboard also are underway. A test of the calibration system was carried out and the designs of the fanout board were refined. Final designs of the BLS system were completed and prototype production will begin soon. An order was placed for the remainder of the switched-capacitor arrays (32 wafers on the 6" line). The packaging vendor suspects that the low yields that have been observed in the SCAs from the 4" line are associated with the bond pads. This possibility is being investigated further and potential solutions will be studied before committing those devices for packaging.

The detector itself is also being prepared for the upgrades - the old preamps, cooling fans, and power supplies are being removed and new cabling for the calibration system is being installed. The power supply infrastructure (steel magnetic shield boxes, water manifolds) is under construction, with six of twenty-four boxes built. The third prototype of the timing and control system is being produced. Lastly, the calibration software effort is expanding with the addition of more manpower.

Supertile production started and 90% of the tiles had their isolation grooves cut and filled with epoxy at Fermilab. The first batch of nine tiles was delivered to the University of Texas-Arlington (UTA), and six tiles were fully assembled there. 70% of the required wavelength-shifting fiber has been cut, polished, and sputter-mirrored at one end. The light yield of the first production tile was consistent with expectations. All the assembly work was carried out in a newly constructed clean room at UTA. Development also continued on the five-meter long clear-fiber cables that transport signals to the ICD crates. The transmission of the prototype cables from Mitsubishi has been unacceptably low and work continued to improve this with better connector polishing techniques. The aluminum boxes that will contain the ICD tiles were ordered and delivered. A problem was discovered with the lids and it is being corrected. The ICD readout motherboard redesign was completed, including HV connections and pulser routing. The electronics drawer design was finished, the mechanical assemblies were ordered, and all the parts were received. Preamps for the ICD also were ordered, and the first 100 high-voltage bases were tested for stability. A test stand was made at Louisiana Tech that uses an ICD tile to study mip signals, and gain studies are underway to determine the final base configuration. This testing is necessary to compensate for the poorer-than-expected transmission of light by the clear-fiber cables. A prototype of the active pulser fanout was received and design changes necessary for the pulser were discussed between the French groups and Louisiana Tech. A final design has been agreed to and will be built by Orsay. A housing to mount the high-voltage fanout on the ICD crate is being designed and built by Louisiana Tech, and design of the modified high-voltage fanout boxes was completed. Also, the first calibration light-mixing box was received from the muon detector group and mounted on a panel of a fiber backplane for the upcoming solenoid test at Fermilab.

All of the 94 WAMUS PDT's are now installed on the detector. New service cards and delay boards also were installed on all of them, and infrastructure installation and testing continued. The new 24-channel front-end boards and a prototype control board were used to readout an installed PDT into prototype electronics located in the counting house.

Pixel counters for the A- and C-layers are at Fermilab and counters for the B-layer were shipped by IHEP. Replacement of high voltage resistors in all phototube bases was completed. Octant assembly began and 8 of 48 octants were built and tested. The rate of octant assembly is consistent with the schedule. All pixel holders for the A-layer were delivered to Fermilab and the production of holders for the B- and C-layers is in progress at IHEP. Work on the low voltage bus and gas system continued.

MDT production resumed after a three-month delay due to lack of parts from a distributor in Yerevan. If necessary, additional production shifts will be set up to recover the lost time. The production and testing of all A-layer MDT's (sufficient for sixteen octants) is complete and tubes for five octants are at Fermilab. A gas leak problem between the PVC envelope and ABS endcap has been solved by application of an adhesive to the joint. The long-term robustness of this solution still must be tested, however.

Detectors, frames, a drilling fixture, and blades are needed to assemble MDT octants. A majority of honeycomb panels to be used for octant frames did not meet the flatness specification. However a method was developed build octant frames within specification using panels that were slightly outside their tolerance. Fourteen of 144 frames were built in this manner. Prototype blades were tested and go-ahead was given for their production. A drilling fixture also was built, however some holes drilled with it did not meet the placement tolerance. Various solutions to this problem are being investigated and octant assembly will begin once a solution is found.

Preproduction 24-channel front-end boards were tested successfully. However the quality of fabrication and assembly were poor and another vendor will be selected for the fabrication of production quantities. Testing of the prototype MDT digitization card and crate controller was completed, and 10% of the production digitization cards were built and tested. Production of the amplifier-discriminator boards continued at Dubna according to schedule. Tighter tolerances in chip testing were levied in order to reduce the threshold variation to within specification. Testing of the prototype scintillator front-end board, prototype muon readout cards, and prototype fanout card were finished, and testing of the prototype scintillator crate controller is in progress. Production quantities of the scintillator front-end board and muon readout cards were ordered, while a second a second prototype of the fanout cards is required before its production can begin.

The Level 1 framework installation is complete and awaits arrival of the Serial Command Link System for multi-crate operation. The conceptual framework for incorporating detector correlations into the Level 1 framework has been completed. The Level 2 framework components are complete now that a modification to include event buffering has been implemented. The system can be assembled when required.

A prototype enclosure for the Luminosity Monitor was fabricated, met specifications, and the final enclosures are now being fabricated. A DØ note is nearly complete that demonstrates forces on the enclosures during a solenoid quench are benign. The layout of the preamplifier printed circuit board was completed and design began on another small printed circuit board that will contain the LED light source drivers. The design of the Luminosity Monitor TDC board also neared completion.

Specification of the entire Level 1 system, most recently the calorimeter and central triggers, is now complete. Prototype cards have been built for the central tracking and muon tracking Level 1 triggers. Preproduction tests have commenced for the muon trigger. The hardware and software required to control the calorimeter trigger has been designed and is partially complete. The central tracking trigger and calorimeter systems in league with the Level 1 Framework now support spatial matching between detectors. Software design has also commenced for the forward preshower detector.

The Level 2 hardware prototype program is well along and parts have been delivered to Fermilab. Final delivery occurred for the commercial VME interface and the purpose-built fiber input converter (FIC) interface cards. Tests of the preproduction alpha processor, Magicbus transcevier (MBT), and muon preprocesser proceeded as scheduled during this quarter. The alpha cards had a high failure rate that is under study. The MBT and muon preprocessor tests have gone well. The trigger simulator remains behind schedule and lacks manpower. The DSP software and muon processor are also manpower limited. Planning for installation and commissioning has begun.

The Level 3 system underwent a full hardware and software review, and as a result detailed hardware design has commenced. The software infrastructure can support filtering examples and awaits a full system test.

An "Online Workshop" was held on June 3-4. The workshop targeted people from the DØ detector sub-groups who will participate in commissioning of the detector hardware. There were overview lectures, demonstrations, and tutorials with a focus on "slow control" and "event monitoring" applications. Detector group users were given detailed instructions on how to build customized applications for specific needs. About 35 people from the detector groups attended the workshop, with total attendance reaching about 70 for the overview lectures. A by-product of the workshop was the determination of the individuals to be involved in these software efforts from within the detector groups. This educational effort of the people involved in commissioning was a major accomplishment.

The capabilities of the Online system which have been introduced or enhanced in this reporting period included:

• installation of a redundant RAID controller for the critical shared disk storage areas
• installation of system monitoring tools
• loading/extraction of EPICS control system information into/from ORACLE database
• improvements and active use of High Voltage control application
• progress on determining event identification parameters (i.e. the equivalent of the "run" and "event" numbers)
• preliminary DAQ throughput rate tests
• alarm system design progress
• trigger and DAQ monitoring framework complete

The following table lists DoE (M1) and Director's (M2) milestones whose baseline dates fall before the end of the third quarter of FY99. (Milestones reached prior to the third quarter have been deleted from the list.). Seven of these milestones have not yet been met.

This section presents a table summarizing the reported Fermilab technical effort during the quarter for each WBS Level 2 Subsystem. This includes reported effort from various engineering and technical teams and technical centers at Fermilab, but does not include physicist or project management effort. Units are in FTEs per quarter. CP - Computing Professional, DES - Designer/Drafter, EE - Electrical Engineer, ET - Electrical Tech, ME - Mechanical Engineer, MT - Mechanical Tech.

The third quarter of fiscal year 1999 closed with obligations for the DØ Upgrade Project totaling $4,638K on equipment M&S funds and $320K on Solenoid AIP Plant funds. As shown in the following table and plot, obligations fell short of planned equipment M&S spending by $2,175K. Note that the Project's spending plan was redefined during the third quarter and thus, differs from the plot distributed at the end of the second quarter. Recent meetings with various Sub-Project Managers have resulted in a better understanding of equipment spending for the remainder of the fiscal year. Although the shortfall in equipment spending is not expected to be completely recovered and reach the $9,910K level originally planned, the outlook is favorable that FY99 M&S funding of about $8,000K will be exhausted.

The M&S Upgrade Project balance is currently $8.365K, excluding contingency. The balance in AIP funds is $.358K. The remaining contingency stands at $2,009K as reported during the June 1999 DoE review. It is expected that during the fourth quarter, change requests (increases) to the Cost Estimate will be submitted which will have an impact on the current contingency balance.

The Project currently has commitments with universities and other institutions in the DØ Collaboration, via active Memoranda of Understanding (MoU), totaling $8,046K. These funds represent an obligation on the part of the DØ Upgrade Project and are regularly costed each month through invoices received from these institutions as work is completed. In addition, several institutions have made significant contributions to the DØ Upgrade. A list of the universities and other institutions involved, as well as a more detailed breakdown of the commitments and costs, is shown on the final page of this report.